Full speech by Deputy Minister Bui Hoang Phuong at the announcement ceremony of the FPT advanced semiconductor testing and packaging plant

On January 28, 2026, in Hanoi, FPT Corporation announced the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant, with the objective of strengthening connectivity across the semiconductor value chain and implementing Vietnam’s major national orientations on mastering core and sovereign technologies, in line with Resolution No. 57-NQ/TW and Decisions No. 1131/QD-TTg and No. 1018/QD-TTg. The initiative contributes to advancing Vietnam’s deeper participation in the global semiconductor supply chain.

This is the first semiconductor testing and packaging plant in Vietnam fully owned and operated by a Vietnamese enterprise, helping to complete the national semiconductor ecosystem across research, design, manufacturing, training, testing and packaging, and commercialization.

The announcement ceremony was attended by Mr. Bui Hoang Phuong, Alternate Member of the Party Central Committee, Member of the Standing Committee of the Party Committee, Deputy Minister of Science and Technology; Mr. Nguyen Khac Lich, Director General of the Department of Information Technology Industry, Ministry of Science and Technology; Senior Lieutenant General Tao Duc Thang, Member of the Party Central Committee, Chairman and CEO of Viettel Group; leaders of FPT Corporation; and representatives of enterprises, research institutes, universities, and major semiconductor partners from Vietnam, Japan, the Republic of Korea, Taiwan and other economies.

Below is the full speech delivered by Deputy Minister of Science and Technology Bui Hoang Phuong at the event.

Deputy Minister of Science and Technology Bui Hoang Phuong delivers remarks at the announcement ceremony of the FPT Advanced Semiconductor Testing and Packaging Plant

Distinguished Senior Lieutenant General Tao Duc Thang,
Chairman and CEO of Viettel Group,

Distinguished Mr. Truong Gia Binh,
Chairman of the Board of Directors of FPT Corporation,

Distinguished delegates and guests,

Today, I am pleased to attend, on behalf of the leadership of the Ministry of Science and Technology, the announcement ceremony of the FPT Advanced Semiconductor Testing and Packaging Plant.

At the outset, I would like to acknowledge and highly commend the persistent efforts and pioneering contributions of FPT Corporation in the semiconductor sector over recent years. Beyond commitments, FPT has demonstrated concrete achievements, from becoming the first Vietnamese enterprise to successfully design a commercial chip, specifically a Power IC, to securing orders for 70 million chips supplied to demanding markets such as Japan, the Republic of Korea and Taiwan during the 2024–2025 period.

With the launch of this plant today, FPT has officially completed the final critical component of a closed semiconductor value chain encompassing design, manufacturing, testing and packaging.

Distinguished delegates,

The inauguration of this plant carries five strategic implications when viewed in the broader national context.

First, in terms of strategic orientation, Vietnam has set ambitious targets for the digital economy to account for 20 percent of GDP by 2025 and 30 percent by 2030. To achieve these challenging goals, the semiconductor industry must serve as a core engine of growth. FPT’s investment in an advanced semiconductor testing and packaging plant represents a concrete and timely step to translate national strategy into reality, closely aligned with the Prime Minister’s Decision No. 1018/QD-TTg.

Second, regarding autonomy and self-reliance, Vietnam currently has more than 58 integrated circuit design enterprises with approximately 7,000 engineers. However, downstream stages such as testing and packaging have remained fully dependent on foreign-invested enterprises. The establishment of this plant marks a historic milestone, as for the first time a Vietnamese enterprise has mastered this critical stage, affirming that Vietnam is not only participating in the global supply chain as a provider of labor, but as a genuine technology owner.

Third, in terms of national positioning, this project reflects FPT’s determination to bring Vietnamese intellect to the global stage. Just as FPT has surpassed USD 1 billion in annual software export revenue, I am confident that similar achievements can be realized in the semiconductor sector, contributing to positioning Vietnam as an emerging destination on the regional semiconductor map.

Fourth, regarding technological vision, I particularly welcome FPT’s focus on advanced packaging technologies. As Moore’s Law approaches its physical limits, advanced packaging has become a core technology for enhancing chip performance. This strategic choice enables Vietnam to leapfrog rather than follow in semiconductor development.

Distinguished delegates,

The Ministry of Science and Technology defines the “Make in Viet Nam” orientation for the 2026–2030 period under a renewed spirit of “Make in Viet Nam to lead”, meaning innovate in Vietnam, manufacture in Vietnam, and lead global trends. We aim not only to produce for domestic use or import substitution, but to create new products and technologies capable of competing and setting direction internationally.

To realize this vision, I propose that FPT focus on four key priorities.

First, pioneering leadership. FPT should assume the role of a leading enterprise in advancing “Make in Viet Nam to lead”. This plant should be a place where high-technology chips branded “Made by FPT” and “Made by Vietnam” are developed and successfully penetrate the most demanding global markets.

Second, deployment of the Multi Project Wafer model. FPT is encouraged to coordinate closely with units under the Ministry of Science and Technology to implement pilot semiconductor production under the MPW model. This will enable research groups and Vietnamese startups to access manufacturing technologies at reasonable cost, thereby fostering innovation across the ecosystem.

Third, ecosystem development. Acting as a leading enterprise, FPT should support domestic small and medium sized enterprises in participating in supply chains for materials and auxiliary equipment, contributing to a more resilient national semiconductor ecosystem.

Fourth, human resource development. The national strategy targets 50,000 semiconductor engineers by 2030. I highly appreciate FPT’s commitment to developing 30,000 semiconductor professionals by 2033, and encourage continued collaboration with institutes and universities to transform this plant into a hands on training center for highly skilled engineers serving national development.

The Ministry of Science and Technology reaffirms its commitment to supporting, facilitating and accompanying FPT. We will continue to improve the legal framework, prioritize resources for research and development, and support enterprises in expanding international cooperation and strengthening leadership in the semiconductor industry.

Once again, congratulations to FPT on this significant milestone.
I wish the FPT Advanced Semiconductor Testing and Packaging Plant successful, sustainable and effective operations.

Thank you.